Form in Place

Form-in-Place electrically conductive silicone compounds are mixed in a planetary and centrifugal non-contact mixer for use in our Form-in-Place (FIP) conductive elastomer gasket deposition robots where we deposit electrically conductive gasket beads directly to our customers hardware Conductive or non conductive elastomer silicone compounds are deposited as a gasket directly to the enclosure by XYZ CNC technology. Suited to applications where small, intricate gasket profiles are required, such as on multi-compartment labyrinth housings with minimum gasket land area where traditional larger types of gasket are not suitable. Gasket beads can be applied directly to the surface of the component or into a groove eliminating the requirement for a separate flat gasket or O-Ring. This process also negates the assembly costs associated with traditional gaskets as the Form-in-Place gasket becomes an integral part of the housing or enclosure. The process is suitable for depositing on both metal and metallised plastic components/housing.

The materials are room temperature vulcanising enabling them to be deposited on to temperature sensitive components Kemtron can also supply FIP compounds in syringes or Semco cartridges for the customer’s own use.

Form-in-Place gasket materials include:

For RFI/EMI Shielding

• Silver plated copper filled silicone
• Silver plated aluminium filled silicone
• Nickel coated graphite filled silicone

For Environmental Sealing only

• Unfilled silicone